| Popis: |
Publisher Summary This chapter discusses the test methods closely related to adhesives for die and substrate attachment, surface-mounting of components, under?ll, and optoelectronic assembly. Physical-property tests are used to measure the properties of adhesives in the liquid or gelled states prior to curing and in the solid state after curing. Visual examination and density after cure are performed to verify that voids are not present or, if present, meet speci?cation requirements. Visual inspection of adhesives is performed on both uncured and cured samples. Uncured materials are inspected for uniformity of ?ller distribution, consistency, and adhesive coverage. The main electrical properties related to organic materials are volume resistivity and dielectric constant and dissipation factor. Adhesives in electronics are also bonded to different surfaces, and corrosion testing is required to verify the stability of cured adhesive interconnects. High-radiation and prolonged radiation exposures in space or satellite applications can result in reduced mechanical attachment and reduced high temperature stability. It is found that bond strength is measured to assure that bonding materials retain adhesion at temperature and after aging or exposure to thermomechanical stresses. |
