A system-level overview and comparison of three High-Speed Serial Links: USB 3.0, PCI Express 2.0 and LLI 1.0
| Autor: | Abdelaziz Goulahsen, Joel P. Huloux, Andre Picco, J. Saade, Frédéric Pétrot |
|---|---|
| Přispěvatelé: | Techniques of Informatics and Microelectronics for integrated systems Architecture (TIMA), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA), STMicroelectronics, Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés (TIMA), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Centre National de la Recherche Scientifique (CNRS), Torella, Lucie |
| Jazyk: | angličtina |
| Rok vydání: | 2013 |
| Předmět: |
business.industry
Computer science [SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics Quality of service 020208 electrical & electronic engineering USB 3.0 02 engineering and technology USB Chip law.invention 03 medical and health sciences 0302 clinical medicine Data efficiency law system level synthesis Embedded system PACS 85.42 0202 electrical engineering electronic engineering information engineering Bit error rate System on a chip [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics business 030217 neurology & neurosurgery Computer hardware PCI Express |
| Zdroj: | Workshop on Design and Diagnostics of Electronic Circuits and Systems (DDECS) Workshop on Design and Diagnostics of Electronic Circuits and Systems (DDECS), Apr 2013, Karlovy Vary, Czech Republic. pp.147-152 DDECS |
| Popis: | International audience; High Speed Serial Links (HSSL) are found in almost all today's System-on-Chip (SoC) connecting different components: the main chip and its I/Os, chip to chip (the main chip to a companion chip, memory sharing between two chips), etc... A variety of standards exist, each of which is used for a specific application, and many parameters affect their performance. In this paper we make a comparison of three high-speed protocols, the USB 3.0, PCI Express 2.0 (PCIe) and LLI 1.0. We analyze their different parameters, mainly the data exchange protocol, errors management, the Bit Error Rate (BER), data efficiency and the quality of service (QoS) for each of the protocols. We also show the relation between these parameters and how improving one parameter could result in a degradation of another, and based on this analysis, we finish by concluding the reason why USB is used for I/Os, PCIe is used for data hungry devices and LLI for memory sharing. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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