Thinning and Weighting of Planar/Conformal Arrays Considering Mutual Coupling Effects
| Autor: | Meng-Xia Yu, Wei Shao, Ran Zhang, Xiao Ding, You-Feng Cheng |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Coupling
Article Subject Computer science Filling factor 020208 electrical & electronic engineering 020206 networking & telecommunications Conformal map 02 engineering and technology lcsh:HE9713-9715 Topology Microstrip Weighting Planar 0202 electrical engineering electronic engineering information engineering Electronic engineering lcsh:Cellular telephone services industry. Wireless telephone industry Effective method lcsh:Electrical engineering. Electronics. Nuclear engineering Electrical and Electronic Engineering Driven element lcsh:TK1-9971 |
| Zdroj: | International Journal of Antennas and Propagation, Vol 2016 (2016) |
| ISSN: | 1687-5877 1687-5869 |
| DOI: | 10.1155/2016/7521723 |
| Popis: | Based on an improved active element pattern (AEP) technique, a novel effective method for sidelobe suppression considering mutual coupling (MC) in planar and conformal sparse arrays is proposed in this paper. A thinning and weighting process that includes the thinning module, optimization module, and far-field calculation module is presented, and three key points, namely, the modified AEP modeling, far-field calculation of planar and conformal thinned arrays, and modified thinning strategy, are highlighted. As an effective optimization algorithm, the differential evolution algorithm (DEA) is adopted in order to achieve low sidelobe. Several numerical examples are shown to validate the consistency and effectiveness of the proposed synthesis approach. With the first use of the AEP technique for the synthesis of sparse arrays, the planar and conformal microstrip arrays with the desired array filling factor are studied to obtain the expected sidelobe level (SLL). |
| Databáze: | OpenAIRE |
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