Influence Of Repair-Related Modification Of Adhesive Bonds On Electromechanical Impedance Characteristics
| Autor: | Malinowski, Paweł Henryk, Wiesław Mieczysław Ostachowicz, Brune, Kai |
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| Rok vydání: | 2016 |
| Zdroj: | Proceedings of the 6th EASN International Conference in Innovation in European Aeronautics Research Proceedings of the 7th EASN International Conference in Innovation in European Aeronautics Research |
| DOI: | 10.5281/zenodo.1245642 |
| Popis: | Numerous techniques of non-destructive testing (NDT) of structural parts of CFRP are investigated. In this research we focus on electromechanical impedance (EMI) technique. This is a technique often considered as NDT or Structural Health Monitoring (SHM) method. It is based on a piezoelectric sensor that is surface mounted to the inspected structure. The electrical quantities of the sensor are measured in wide frequency range. Due to direct and converse piezoelectric effects the electrical response of the sensor is related to mechanical response of the structure to which the sensors is bonded to. In the reported research adhesively bonded CFRP samples were investigated. Within the investigation properly bonded (referential) samples were consider together with samples with modified bond. The adhesive bonds were modified in order to simulate repair-related defects. Following modifications were considered: pre-bond thermal treatment, pre-bond contaminated with a de-icing fluid, and faulty curing of the adhesive. The electromechanical impedance spectra were investigated searching for anomalies and changes caused by modification of the adhesive bond. These spectra for different cases were compared with reference measurement results gathered from pristine samples. Numerical indexes for comparison of the EMI characteristics were proposed. The sensitivity of the EMI method to modified bonds was observed. |
| Databáze: | OpenAIRE |
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