Mechanical Properties of Cu2O Thin Films by Nanoindentation
| Autor: | Sheng-Rui Jian, Guo-Ju Chen, Wei-Min Hsu |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2013 |
| Předmět: |
Diffraction
Materials science nanoindentation Scanning electron microscope XRD Cu2O thin film Modulus lcsh:Technology Article AFM SEM hardness General Materials Science Composite material Thin film lcsh:Microscopy lcsh:QC120-168.85 lcsh:QH201-278.5 lcsh:T Nanoindentation Microstructure Grain size Crystallography lcsh:TA1-2040 Nanoindenter lcsh:Descriptive and experimental mechanics lcsh:Electrical engineering. Electronics. Nuclear engineering lcsh:Engineering (General). Civil engineering (General) lcsh:TK1-9971 |
| Zdroj: | Materials, Vol 6, Iss 10, Pp 4505-4513 (2013) Materials; Volume 6; Issue 10; Pages: 4505-4513 Materials |
| ISSN: | 1996-1944 |
| Popis: | In this study, the structural and nanomechanical properties of Cu2O thin films are investigated by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM) and nanoindentation techniques. The Cu2O thin films are deposited on the glass substrates with the various growth temperatures of 150, 250 and 350 °C by using radio frequency magnetron sputtering. The XRD results show that Cu2O thin films are predominant (111)-oriented, indicating a well ordered microstructure. In addition, the hardness and Young’s modulus of Cu2O thin films are measured by using a Berkovich nanoindenter operated with the continuous contact stiffness measurements (CSM) option. Results indicated that the hardness and Young’s modulus of Cu2O thin films decreased as the growth temperature increased from 150 to 350 °C. Furthermore, the relationship between the hardness and films grain size appears to closely follow the Hall-Petch equation. |
| Databáze: | OpenAIRE |
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