Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor
| Autor: | Qianlong Wang, Nan Wang, Guangjie Yuan, Abdelhafid Zehri, Shujing Chen, Xiaohua Liu, Johan Liu |
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| Rok vydání: | 2019 |
| Předmět: |
oxidation resistance
Materials science Fabrication chemistry.chemical_element cold wall reactor Chemical vapor deposition 010402 general chemistry 01 natural sciences law.invention Thermal conductivity law thermal conductivity Thermal stability Composite material Electrical conductor 010405 organic chemistry Graphene Communication copper particles graphene General Chemistry Copper Communications 0104 chemical sciences chemistry Adhesive |
| Zdroj: | ChemistryOpen |
| ISSN: | 2191-1363 |
| DOI: | 10.1002/open.201800228 |
| Popis: | Functional fillers, such as Ag, are commonly employed for effectively improving the thermal or electrical conductivity in polymer composites. However, a disadvantage of such a strategy is that the cost and performance cannot be balanced simultaneously. Therefore, the drive to find a material with both a cost efficient fabrication process and excellent performance attracts intense research interest. In this work, inspired by the core–shell structure, we developed a facile manufacturing method to prepare graphene‐encapsulated Cu nanoparticles (GCPs) through utilizing an improved chemical vapor deposition (CVD) system with a cold wall reactor. The obtained GCPs could retain their spherical shape and exhibited an outstanding thermal stability up to 179 °C. Owing to the superior thermal conductivity of graphene and excellent oxidation resistance of GCPs, the produced GCPs are practically used in a thermally conductive adhesive (TCA), which commonly consists of Ag as the functional filler. Measurement shows a substantial 74.6 % improvement by partial replacement of Ag with GCPs. |
| Databáze: | OpenAIRE |
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