Thermal and electrostatic reliability characterization in RF MEMS switches

Autor: Francis Pressecq, Petra Schmitt, Xavier Lafontan, F. Flourens, Lionel Buchaillot, Patrick Pons, Dominique Collard, Q.H. Duong
Přispěvatelé: Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 (IEMN), Centrale Lille-Institut supérieur de l'électronique et du numérique (ISEN)-Université de Valenciennes et du Hainaut-Cambrésis (UVHC)-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)
Rok vydání: 2005
Předmět:
Zdroj: Microelectronics Reliability
Microelectronics Reliability, 2005, 45, pp.1790-1793
Microelectronics Reliability, Elsevier, 2005, 45, pp.1790-1793
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2005.07.095
Popis: The reliability of RF MEMS switches is closely linked to their operational and environmental conditions. This paper examines the reliability of five different capacitive switch designs by a combined use of modeling and experimental tools. Three-dimensional multiphysics finite element analysis was performed to estimate the actuation voltage and deflection vs. temperature variations of the micro-switches. The effect of temperature and temperature cycles on switch dilatation and pull-in voltage are studied, as well as the influence of different operational signals on switch reliability.
Databáze: OpenAIRE