An Enhanced Random Vibration and Fatigue Model for Printed Circuit Boards
| Autor: | Flávio Luiz de Silva Bussamra, Bruno De Castro Braz |
|---|---|
| Jazyk: | angličtina |
| Předmět: |
Engineering
Aerospace Engineering Ocean Engineering 02 engineering and technology law.invention Printed circuit board law 0202 electrical engineering electronic engineering information engineering medicine General Materials Science Civil and Structural Engineering lcsh:QC120-168.85 PCB business.industry Mechanical Engineering 020208 electrical & electronic engineering Stiffness Structural engineering 021001 nanoscience & nanotechnology Vibration Capacitor Mechanics of Materials visual_art Automotive Engineering Electronic component visual_art.visual_art_medium Random vibration fatigue lcsh:Descriptive and experimental mechanics medicine.symptom 0210 nano-technology business Cycle count lcsh:Mechanics of engineering. Applied mechanics lcsh:TA349-359 Vibration fatigue |
| Zdroj: | Latin American Journal of Solids and Structures, Vol 14, Iss 13, Pp 2402-2422 Latin American Journal of Solids and Structures, Volume: 14, Issue: 13, Pages: 2402-2422, Published: 2017 Latin American Journal of Solids and Structures v.14 n.13 2017 Latin American journal of solids and structures Associação Brasileira de Engenharia e Ciências Mecânicas (ABCM) instacron:ABCM |
| ISSN: | 1679-7825 |
| Popis: | Aerospace vehicles are mostly exposed to random vibration loads during its operational lifetime. These harsh conditions excites vibration responses in the vehicles printed circuit boards, what can cause failure on mission functionality due to fatigue damage of electronic components. A novel analytical model to evaluate the useful life of embedded electronic components (capacitors, chips, oscillators etc.) mounted on Printed Circuit Boards (PCB) is presented. The fatigue damage predictions are calculated by the relative displacement between the PCB and the component, the lead stiffness, as well the natural vibration modes of the PCB and the component itself. Statistical methods are used for fatigue cycle counting. The model is applied to experimental fatigue tests of PCBs available on literature. The analytical results are of the same magnitude order of the experimental findings. |
| Databáze: | OpenAIRE |
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