Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs
| Autor: | Grigory Onushkin, Anton Alexeev, Genevieve Martin |
|---|---|
| Přispěvatelé: | Signal Processing Systems, Lighting and IoT Lab |
| Jazyk: | angličtina |
| Předmět: |
Model extraction
Materials science Silicone dome Mechanical engineering 02 engineering and technology 01 natural sciences law.invention Dynamic thermal compact model chemistry.chemical_compound Dome (geology) Silicone law 0103 physical sciences Thermal Electrical and Electronic Engineering Safety Risk Reliability and Quality Thermal characterization 010302 applied physics LED 021001 nanoscience & nanotechnology Condensed Matter Physics Transient analysis Thermal transient analysis Atomic and Molecular Physics and Optics Finite element method Surfaces Coatings and Films Electronic Optical and Magnetic Materials Structure function chemistry Path (graph theory) Secondary heat path 0210 nano-technology Light-emitting diode |
| Zdroj: | Microelectronics Reliability, 87, 89-96. Elsevier Microelectronics Reliability |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2018.05.014 |
| Popis: | A new multiple heat path dynamic compact model extraction method for LED packages with silicone domes is proposed. The method enables separate characterization of the LEDs dome and the main heat path. It is based on thermal transient analysis of LED configurations with and without the dome. The heat paths de-embedding procedure proposed significantly increases accuracy of the LED thermal characterization compared to a typical singular heat path approach. The method is demonstrated with a representative mid-power LED. The results are validated with steady-state FEA. Suppressed estimation errors of the heat path evaluation are indicated. |
| Databáze: | OpenAIRE |
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