Effect of hexamethylenetetramine on surface smoothness of electroplated copper coating
| Autor: | Yang Wenyao, Xiang Jing, Xu Yonggang, Li Jie, Wang Jingjie, Zeng Chong, Sheng Wenjing |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2021 |
| Předmět: |
Materials science
Scanning electron microscope 020209 energy chemistry.chemical_element 02 engineering and technology 021001 nanoscience & nanotechnology Electrochemistry Copper Environmental sciences chemistry.chemical_compound chemistry 0202 electrical engineering electronic engineering information engineering GE1-350 Hexamethylenetetramine Cyclic voltammetry Composite material 0210 nano-technology Polarization (electrochemistry) Electroplating Layer (electronics) |
| Zdroj: | E3S Web of Conferences, Vol 267, p 02066 (2021) |
| ISSN: | 2267-1242 |
| Popis: | In this paper, hexamethyltetramine is introduced into the electroplating bath to improve the surface morphology of electrodeposited copper. The cyclic voltammetry (CV) and dynamic polarization curves are used to study the effect of Cu(Ⅰ) and hexamethyltetramine on the electrochemical behaviors of electroplating solution. After implementing the electrodeposited copper experiment, scanning electron microscope (SEM) and X-ray diffraction (XRD) are used to explore the influence of Cu(Ⅰ) and hexamethyltetramine on the Surface morphology and crystal plane orientation of the electrodeposited copper. The results show that 5ppm hexamethyltetramine and 7.5ppm hexamethyltetramine can solve the problem of the loose and uneven surface of the electroplated copper layer caused by Cu(Ⅰ). |
| Databáze: | OpenAIRE |
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