Tin deposition on ruthenium and its influence on blistering in multi-layer mirrors
| Autor: | Shuxia Tao, Vianney Koelman, Geert Brocks, Thomas Morgan, Chidozie Onwudinanti |
|---|---|
| Přispěvatelé: | Materials Simulation & Modelling, Computational Materials Physics, Electronic Structure Materials, Center for Computational Energy Research, Science and Technology of Nuclear Fusion, EIRES Chem. for Sustainable Energy Systems, EAISI Foundational, MESA+ Institute, Computational Materials Science |
| Jazyk: | angličtina |
| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Materials science Hydrogen business.industry Extreme ultraviolet lithography General Physics and Astronomy chemistry.chemical_element Blisters 02 engineering and technology Substrate (electronics) 021001 nanoscience & nanotechnology 01 natural sciences Ruthenium Chemistry chemistry 0103 physical sciences medicine Optoelectronics Physical and Theoretical Chemistry medicine.symptom 0210 nano-technology Tin business Layer (electronics) Deposition (law) |
| Zdroj: | Physical Chemistry Chemical Physics, 23, 13878-13884 Physical Chemistry Chemical Physics Physical Chemistry Chemical Physics, 23(25), 13878-13884. Royal Society of Chemistry Physical chemistry chemical physics, 23(25), 13878-13884. Royal Society of Chemistry |
| ISSN: | 1463-9076 |
| DOI: | 10.1039/d1cp01082d |
| Popis: | An atomistic description of tin deposition on ruthenium and its effect on blistering damage is of great interest in extreme ultraviolet (EUV) lithography. In EUV machines, tin debris from the EUV-emitting tin plasma may be deposited on the mirrors in the optical path. Tin facilitates the formation of hydrogen-filled blisters under the ruthenium top layer of the multi-layer mirrors. We have used Density Functional Theory (DFT) to show that tin deposition on a clean ruthenium surface exhibits a film-plus-islands (Stranski–Krastanov) growth mode, with the first atomic layer bonding strongly to the substrate. We find that a single tin layer allows hydrogen to reach the ruthenium surface and subsurface more easily than on clean ruthenium, but hydrogen penetration through the tin film becomes progressively more difficult when more layers are added. The results indicate that hydrogen penetration and blistering occur when only a thin layer of tin is present. A monolayer of Sn makes the Ru surface more permeable to H, but more layers inhibit H penetration. |
| Databáze: | OpenAIRE |
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