Measurement of residual stress by slot milling with focused ion-beam equipment
| Autor: | Neus Sabaté, Joan Ramon Morante, Bruno Michel, Carles Cané, Isabel Gràcia, Dietmar Vogel, Astrid Gollhardt, J. Keller |
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| Přispěvatelé: | Publica |
| Rok vydání: | 2006 |
| Předmět: |
Materials science
Mechanical Engineering Mineralogy Modulus Chemical vapor deposition Focused ion beam Electronic Optical and Magnetic Materials chemistry.chemical_compound Silicon nitride chemistry Mechanics of Materials Residual stress Bulge test Displacement field Electrical and Electronic Engineering Composite material Layer (electronics) |
| Zdroj: | Journal of Micromechanics and Microengineering. 16:254-259 |
| ISSN: | 1361-6439 0960-1317 |
| DOI: | 10.1088/0960-1317/16/2/009 |
| Popis: | In this paper, the authors present a new approach to residual stress measurement that takes advantage of the combined imaging-milling capabilities of focused ion-beam equipment. The method is based on the measurement of the displacement field originated when a slot of a few microns is milled on the material under study. The fitting of the experimental results with an analytical model together with the independent determination of Young's modulus allows us to find the residual stress of the layer under study. The complete experimental procedure is described and its feasibility is demonstrated on a LPCVD silicon nitride micromachined membrane. Values obtained by this new method show a good agreement with values obtained by a classical method such as the bulge test. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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