Leakage characteristics of advanced MOS capacitors with hafnium silicate dielectric and Ru electrode
Autor: | Tapajna, M., Husekova, K., Frohlich, K., Dobrocka, E., Roozeboom, F., Breza, J., Donoval, D., Vavrinsky, E. |
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Jazyk: | angličtina |
Rok vydání: | 2006 |
Předmět: | |
Zdroj: | 2006 Sixth International Conference on Advanced Semiconductor Devices and Microsystems. Smolenice Castle, Slovakia. 16-18 Oct. 2006, 21-24 STARTPAGE=21;ENDPAGE=24;TITLE=2006 Sixth International Conference on Advanced Semiconductor Devices and Microsystems. Smolenice Castle, Slovakia. 16-18 Oct. 2006 |
DOI: | 10.1109/asdam.2006.331144 |
Popis: | The authors have studied the leakage characteristics of Ru/Hf/sub x/Si /sub 1-x/O/sub y//Si MOS capacitors projected for advanced CMOS gate technology. Prior to Ru gate electrode deposition, the gate dielectrics were annealed by RTA in the temperature range of 700 - 1000 degC in O/sub 2/. The influence of RTA has been analyzed by X-ray diffraction, X-ray reflectivity and capacitance-voltage techniques. RTA at temperatures ranging from 800 - 900 degC improves the leakage characteristics. Presumably, the Pool-Frenkel mechanism controls the current flow through the oxide with Ru electrode |
Databáze: | OpenAIRE |
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