| Autor: |
Hirman, Martin, Říha, Marek, Navrátil, Jiří, Steiner, František |
| Rok vydání: |
2022 |
| Předmět: |
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| Zdroj: |
2022 International Conference on Diagnostics in Electrical Engineering (Diagnostika). |
| DOI: |
10.1109/diagnostika55131.2022.9905177 |
| Popis: |
This paper deals with the reliability under the flowing mixed gases corrosion test of interconnection techniques for the mounting surface mounted device (SMD) component. In the experiment, three types of substrates (conductive stretchable textile ribbon, knitted fabric, and flexible kapton substrate) and three contacting techniques (low-temperature soldering, isotropic electrically conductive adhesive bonding, and non-conductive adhesive bonding) were used. The experiment provided proof that soldered or non-conductive adhesive bonded samples are applicable even in a contaminated or industrial corrosive atmosphere, and the electrical resistance of joints on these samples remains acceptable. It follows e-textiles with soldered or non- =conductive adhesive bonded components can also be used in a contaminated or industrial atmosphere. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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