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In this study, a three-dimensional model with multi-parameter order reduction is applied to the thermal modelling of power electronics modules with complex geometries. Finite element or finite difference method can be used to establish accurate mathematical models for thermal analyses. Unfortunately, the resulting computational complexity hinders the analysis in parametric studies. This study proposes a parametric order reduction technique that can significantly increase simulation efficiency without significant penalty in the prediction accuracy. The method, based on the block Arnoldi method, is illustrated with reference to a multi-chip SiC power module mounted on a forced air-cooled finned heat sink with a variable mass flow rate. |
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