New prospects on high on-current and steep subthreshold slope for innovative Tunnel FET architectures

Autor: C. Le Royer, C. Diaz Llorente, Jing Wan, Gerard Ghibaudo, Sebastien Martinie, J.-P. Colinge, Maud Vinet, Sorin Cristoloveanu
Přispěvatelé: Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Institut de Microélectronique, Electromagnétisme et Photonique - Laboratoire d'Hyperfréquences et Caractérisation (IMEP-LAHC ), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes [2016-2019] (UGA [2016-2019])
Jazyk: angličtina
Rok vydání: 2019
Předmět:
Zdroj: Solid-State Electronics
Solid-State Electronics, 2019, 159, pp.26-37. ⟨10.1016/j.sse.2019.03.046⟩
Solid-State Electronics, Elsevier, 2019, 159, pp.26-37. ⟨10.1016/j.sse.2019.03.046⟩
ISSN: 0038-1101
DOI: 10.1016/j.sse.2019.03.046⟩
Popis: We propose three innovative SOI Tunnel FET architectures to solve the recurrent issue of low ION and degraded subthreshold slope measured on TFETs. These are evaluated and compared with a standard TFET structure (with lateral tunneling) using the Sentaurus TCAD tool. Extending the source (anode) at the bottom of the body region generates vertical band-to-band tunneling. Moreover, reducing the vertical distance between the extension and the gate oxide (Lrt) yields a very steep slope and higher ION compared to a device with only lateral tunneling, but only for gate lengths longer than 100 nm. Using an ultrahigh boron dopant concentration (1021 cm−3) thin layer at the bottom for extremely small body thickness (TSi
Databáze: OpenAIRE