| Autor: |
Anoldo Laura, Malta Giuliana, Mazza Bruna, Piccione Giuseppe Gabriele, Calabretta Michele, Russo Sebastiano, Russo Alfio, Sitta Alessandro, Messina Angelo, Lionetto Antonio, Patanè Salvatore |
| Jazyk: |
angličtina |
| Předmět: |
|
| Zdroj: |
Microelectronics Reliability. 138:114700 |
| ISSN: |
0026-2714 |
| DOI: |
10.1016/j.microrel.2022.114700 |
| Popis: |
Nowadays the increasing demand of high-efficiency power devices for automotive framework, forced the scientific community to develop new technologies capable to operate under intense power loads. Among the broad scenario SiC-based substrates represent a promising solution. This study focuses on a high-speed thermal characterization of a power module designed by STMicroelectronics (ACEPACK DRIVE) with the aim to provide a map of the temperature values reached at the surface upon current-pulse stresses. Thermal images collected on one leg show a symmetrical temperature distribution, with a maximum of around 60 ◦C on the device metals and ensures that any reliability issues due to the thermo-mechanical stress are avoided. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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