Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity

Autor: Régis Meuret, Caroline Richard, Eric Woirgard, Donatien Martineau, Wafaa Rmili, G. Le Quilliec, Stephane Azzopardi, Toni Youssef, Nicolas Vivet
Přispěvatelé: Laboratoire de l'intégration, du matériau au système (IMS), Université Sciences et Technologies - Bordeaux 1 (UB)-Institut Polytechnique de Bordeaux-Centre National de la Recherche Scientifique (CNRS), Laboratoire de Mécanique et de Rhéologie (LMR), Université de Tours (UT)-Polytech'Tours-Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA), STMicroelectronics [Tours] (ST-TOURS), SAFRAN, Grp Hispano Suiza, SAFRAN Group, European Project: SiCRATES, Université Sciences et Technologies - Bordeaux 1-Institut Polytechnique de Bordeaux-Centre National de la Recherche Scientifique (CNRS), Institut National des Sciences Appliquées - Centre Val de Loire (INSA CVL), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université de Tours (UT)-Polytech'Tours, Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Université de Tours-Polytech'Tours
Jazyk: angličtina
Rok vydání: 2015
Předmět:
Materials science
business.product_category
Sintering
Young's modulus
02 engineering and technology
01 natural sciences
7. Clean energy
[SPI.MAT]Engineering Sciences [physics]/Materials
symbols.namesake
Reliability (semiconductor)
Thermal conductivity
0103 physical sciences
[SPI.MECA.MEMA]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Mechanics of materials [physics.class-ph]
Electrical and Electronic Engineering
Composite material
Safety
Risk
Reliability and Quality
Porosity
010302 applied physics
021001 nanoscience & nanotechnology
Condensed Matter Physics
Atomic and Molecular Physics
and Optics
Nanocrystalline material
Surfaces
Coatings and Films
Electronic
Optical and Magnetic Materials
[SPI.TRON]Engineering Sciences [physics]/Electronics
Power module
symbols
[PHYS.MECA.THER]Physics [physics]/Mechanics [physics]/Thermics [physics.class-ph]
Die (manufacturing)
0210 nano-technology
business
Zdroj: Microelectronics Reliability
Microelectronics Reliability, 2015, 55 (9-10), pp.1997-2002. ⟨10.1016/j.microrel.2015.06.085⟩
Microelectronics Reliability, Elsevier, 2015, 55 (9-10), pp.1997-2002. ⟨10.1016/j.microrel.2015.06.085⟩
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2015.06.085⟩
Popis: International audience; Along with the need to drastically limit the emission of greenhouse gases, the increase of electric or hybrid solutions in the market mostly relies on their dependability with a specific focus on reliability of the embedded power electronics. Due to RoHS restrictions, conventional lead-based solders cannot be used anymore. Sintered nanometric silver paste was chosen as an alternative candidate because of its high melting point, its promising behavior under aging, its better thermal and electrical conductivities and its low sensitivity to oxidation. However, few data are available in the literature concerning its mechanical properties. The processing route, based on the sintering of nanocrystalline powder, provides a material with significant porosity that is known to modify the mechanical properties when compared to the dense material. In this work, the identification of the porosity rate of such material after sintering process is investigated and hence the reliability of silver sintering depending on porosity rate is also analyzed.
Databáze: OpenAIRE
Externí odkaz: