Influence of Underfill Methods on the Solder Joint Fatigue of Wafer Level Packaging
| Autor: | Patrick Poirier, Charles Regard, Hélène Fremont, Christian Gautier |
|---|---|
| Přispěvatelé: | Fremont, Hélène |
| Jazyk: | angličtina |
| Rok vydání: | 2008 |
| Předmět: |
Stress (mechanics)
Reliability (semiconductor) Materials science Chip size Soldering [SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics Electronic engineering Miniaturization Mechanical engineering Joint (geology) Wafer-level packaging Flip chip ComputingMilieux_MISCELLANEOUS |
| Popis: | To increase miniaturization, CSWLP (chip size wafer level packaging) has been developed. However, the difficulty to get good solder joint reliability leads to manufacture only small CSWLP modules. Different underfill methods are evaluated here, by measurements and simulations: results prove that underfill is necessary, but a bad choice can also decrease the reliability. An original method called “re-enforcement” improves the life time. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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