| Autor: |
Wojciech Stęplewski, Gerhard Podhradsky, Roland Ambrosch, Aneta Arazna, Kamil Janeczek, Piotr Ciszewski, Janusz Sitek, Piotr Dawidowicz, Marek Koscielski |
| Rok vydání: |
2019 |
| Předmět: |
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| Zdroj: |
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| DOI: |
10.23919/empc44848.2019.8951884 |
| Popis: |
A positive trend towards circular economy in many domains has been observed. This approach is based on reuse, repair activities that would lead to new functional device or a retrofitting that would lead to a new product. The standard period of use of mobile electronic devices is short and although the device as whole or partly might be still functional it usually is recycled as whole. It has been proven that recycling might not be the optimal way to source the materials that would be reused as there is possibility of the use of the components almost “as is” to bring them to second lift. The presented article focuses on the ball grid array (BGA) chips that are often used in nowadays electronic devices. The sourced chips were retrofitted to a new design devices that has been tested. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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