Regularities of Structure Formation in 30 mm Rods of Thermoelectric Material during Hot Extrusion
| Autor: | Ivan Yu. Yarkov, Yuri N. Parkhomenko, Nataliya Yu. Tabachkova, N. A. Verezub, Vladimir T. Bublik, Viktoriya P. Panchenko, Filipp Milovich, M. G. Lavrentev, Mikhail V. Voronov, A. I. Prostomolotov |
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| Jazyk: | angličtina |
| Rok vydání: | 2021 |
| Předmět: |
hot extrusion
Technology Materials science bismuth telluride thermoelectric material texture mathematical simulation thermoelectric figure of merit Scanning electron microscope Article chemistry.chemical_compound Seebeck coefficient Thermoelectric effect General Materials Science Bismuth telluride Texture (crystalline) Composite material Microscopy QC120-168.85 QH201-278.5 Engineering (General). Civil engineering (General) Microstructure Thermoelectric materials TK1-9971 Descriptive and experimental mechanics chemistry Extrusion Electrical engineering. Electronics. Nuclear engineering TA1-2040 |
| Zdroj: | Materials; Volume 14; Issue 22; Pages: 7059 Materials Materials, Vol 14, Iss 7059, p 7059 (2021) |
| ISSN: | 1996-1944 |
| DOI: | 10.3390/ma14227059 |
| Popis: | In this study, Ingots of (Bi, Sb)2Te3 thermoelectric material with p-type conductivity have been obtained by hot extrusion. The main regularities of hot extrusion of 30 mm rods have been analyzed with the aid of a mathematical simulation on the basis of the joint use of elastic-plastic body approximations. The phase composition, texture and microstructure of the (Bi, Sb)2Te3 solid solutions have been studied using X-ray diffraction and scanning electron microscopy. The thermoelectric properties have been studied using the Harman method. We show that extrusion through a 30 mm diameter die produces a homogeneous strain. The extruded specimens exhibit a fine-grained structure and a clear axial texture in which the cleavage planes are parallel to the extrusion axis. The quantity of defects in the grains of the (Bi, Sb)2Te3 thermoelectric material decreases with an increase in the extrusion rate. An increase in the extrusion temperature leads to a decrease in the Seebeck coefficient and an increase in the electrical conductivity. The specimens extruded at 450 °C and a 0.5 mm/min extrusion rate have the highest thermoelectric figure of merit (Z = 3.2 × 10−3 K−1). |
| Databáze: | OpenAIRE |
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