Thermal modeling of BGA package families using the Thermal Resistance and Impedance Calculator (TRIC)
| Autor: | Vincenzo d'Alessandro, Domenico Cerracchio, Lorenzo Codecasa, Claudio Maria Villa, Donata Gualandris, Francesca De Viti, Arianna Morelli |
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| Přispěvatelé: | Codecasa, Lorenzo, De Viti, Francesca, Cerracchio, Domenico, D'Alessandro, Vincenzo, Gualandris, Donata, Morelli, Arianna, Maria Villa, Claudio |
| Jazyk: | angličtina |
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Computer science Thermal resistance 020208 electrical & electronic engineering Mechanical engineering 02 engineering and technology Integrated circuit 01 natural sciences law.invention Calculator law Ball grid array 0103 physical sciences Thermal 0202 electrical engineering electronic engineering information engineering Electrical impedance |
| Popis: | This paper presents the thermal modeling of Ball Grid Array (BGA) package families using the Thermal Resistance and Impedance Calculator (TRIC) simulation tool. The intrinsic complexity and the great variability of the BGA families make it necessary the introduction of a calibrated thermal modeling strategy, exploiting some of the Authors experiences. In particular, the adoption of equivalent blocks to model the package structure drastically simplifies the geometry definition and the mesh issues to calculate the thermal data in a short amount of time, still guaranteeing the requested level of accuracy. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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