SMPS electromagnetic noise in System-on-Chip: Noise propagation
| Autor: | Arnaud Breard, Bruno Allard, Eric Feltrin, Christian Vollaire, David Chesneau |
|---|---|
| Přispěvatelé: | STMicroelectronics [Grenoble] (ST-GRENOBLE), Ampère, Département Méthodes pour l'Ingénierie des Systèmes (MIS), Ampère (AMPERE), École Centrale de Lyon (ECL), Université de Lyon-Université de Lyon-Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE)-École Centrale de Lyon (ECL), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE), Ampère, Département Energie Electrique (EE) |
| Jazyk: | angličtina |
| Rok vydání: | 2020 |
| Předmět: |
Buck converter
Computer science Chip 7. Clean energy switching noise Noise [SPI]Engineering Sciences [physics] System-on-Chip (SoC) visual_art Electronic component propagation Electronic engineering visual_art.visual_art_medium System on a chip Power Management Unit Switched Mode Power Supply (SMPS) buck converter Ground plane Voltage |
| Zdroj: | Proceedings of the 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity EMCSI EMCSI, Jul 2020, Reno, NV, United States. pp.507-510, ⟨10.1109/EMCSI38923.2020.9191496⟩ |
| DOI: | 10.1109/EMCSI38923.2020.9191496⟩ |
| Popis: | International audience; There is a trend for embedding of a power management unit along with digital system-on-chip. Few off-chip passive components are necessary. The embedded power management unit is meant to deliver dynamical adequate voltage levels to improve the performances of the mix-mode system. The conversion architecture is optimized in efficiency against high and low power mode but preventing impacts on the analog performance of sensitive blocks in the mix-mode system. The active part of an inductive buck converter is integrated but some switching noise is observed that severely impact analog blocks. The objective of this work is the analysis of the noise propagation of the SMPS noise in the SoC part. The whole system, i.e. the electronic board holding the package and the SoC-chip, is modeled to extract the system-level propagation paths between the buck converter and sensitive blocks. The analysis of the model permits to discriminate the different propagation paths inside the chip through the silicon substrate or outside by PCB interconnection and ground plane. The model is verified by measurement on a test vehicle. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|