Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
| Autor: | Bart Allaert, Riet Labie, Johan De Baets, Lieven Degrendele, Filip Vanhee, Franco Zanon, Bart Vandevelde, Ralph Lauwaert, Geert Willems, Davy Pissoort |
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| Rok vydání: | 2017 |
| Předmět: |
Engineering
02 engineering and technology Bending Temperature cycling Printed circuit board 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering Safety Risk Reliability and Quality Joint (geology) reliability business.industry 020208 electrical & electronic engineering Structural engineering 021001 nanoscience & nanotechnology Condensed Matter Physics four-point bending Atomic and Molecular Physics and Optics Finite element method Surfaces Coatings and Films Electronic Optical and Magnetic Materials Creep Soldering visual_art Electronic component visual_art.visual_art_medium 0210 nano-technology business |
| Zdroj: | Microelectronics Reliability. 74:131-135 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2017.04.008 |
| Popis: | This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (PCB) through cyclic board bending. During the cycling, the temperature is kept constant, preferably at elevated temperature in order to accelerate the creep deformation of the solder joint. This is done in a four-point bending setup which allows to apply an equal loading on all components lying between the inner bars. The scope of the paper is, firstly, to evaluate if the four point bending testing generates the same fatigue fracture as in thermal cycling; secondly, that the measured life times can be also predicted through finite element simulations; and thirdly if the technique can finally accelerate the cycling frequency to reduce the testing time. ispartof: Microelectronics Reliability vol:74 pages:131-135 ispartof: location:FRANCE, Montpellier status: published |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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