High-power-density spot cooling using bulk thermoelectrics

Autor:	Ali Shakouri, Yan Zhang, Gehong Zeng
Rok vydání:	2004
Předmět:	Thermoelectric element Thermoelectric cooling Materials science Physics and Astronomy (miscellaneous) Silicon business.industry Cooling temperature chemistry.chemical_element High power density Thermoelectric materials chemistry Thermoelectric effect Optoelectronics Current (fluid) business
Zdroj:	Zhang, Y; Shakouri, A; & Zeng, G H. (2004). High-power-density spot cooling using bulk thermoelectrics. Applied Physics Letters, 85(14), 2977-2979. UC Santa Cruz: Retrieved from: http://www.escholarship.org/uc/item/0j2975j6
ISSN:	1077-3118 0003-6951
DOI:	10.1063/1.1800290
Popis:	We demonstrate a three-dimensional (3D) bulk silicon microcooler, which has the advantages of high cooling power densities and is less dependent on thermoelectric element's thickness as compared with the same device with one-dimensional (1D) geometry. We measured a maximum cooling of 1.2 degreesC for a 40x40 mum(2) area bulk silicon microcooler device, which is equivalent to an estimated cooling power density of 580 W/cm(2). In this unique geometry, both current and heat spreading in 3D allows the maximum cooling temperature to exceed the conventional 1D thermoelectric model's theoretical limit 0.5 ZT(c)(2). (C) 2004 American Institute of Physics.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9c6c91ed8399419497d22ffd9e08213e https://doi.org/10.1063/1.1800290 Zobrazit plný text záznamu