A novel Z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs
| Autor: | Ahmad Hosseinbeig, Keith Bryan Hardin, Zach Kratzer, John Thomas Fessler, Ying S. Cao, James L. Drewniak, Nana Dikhaminjia, Biyao Zhao |
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| Rok vydání: | 2017 |
| Předmět: |
Engineering
Materials science Computer Networks and Communications Ripple ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION Hardware_PERFORMANCEANDRELIABILITY 02 engineering and technology Integrated circuit Decoupling capacitor Capacitance law.invention Printed circuit board law Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Copper plating Electrical and Electronic Engineering Ceramic capacitor Instrumentation Electrical impedance ComputingMethodologies_COMPUTERGRAPHICS business.industry Electrical engineering 020206 networking & telecommunications Capacitor Signal Processing Optoelectronics Equivalent circuit business Software |
| Zdroj: | IEEE Electromagnetic Compatibility Magazine. 6:91-97 |
| ISSN: | 2162-2272 2162-2264 |
| DOI: | 10.1109/memc.0.8093847 |
| Popis: | A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of surface mounted integrated circuits. The capacitor is multi-layer ceramic capacitor (MLCC) that is a right cylindrical shape with via channels in the outer wall along the axis of the part. The capacitor called a Z-Directed component (ZDC) is then pressed into a hole in the PCB. The connections to the component are then made by the copper plating process similar to via hole construction. This new configuration dramatically improves the PDN performance of PCBs with fewer components than the conventional solution with SMD decoupling capacitors. |
| Databáze: | OpenAIRE |
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