Developments of VCSEL-based transceivers for Co-Packaging
| Autor: | Daniel M. Kuchta |
|---|---|
| Rok vydání: | 2023 |
| Zdroj: | Optical Fiber Communication Conference (OFC) 2023. |
| DOI: | 10.1364/ofc.2023.m4e.6 |
| Popis: | This paper covers recent industry developments in VCSEL-based transceivers that are designed for co-packaging on a first level package with ASICs, such as CPUs, GPUs, and data center switches. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|