PRESSURE DROP CHARACTERISTICS OF CIRCUIT BOARD WITH ARRAYS OF LSI PACKAGES

Autor: Takehiko Yanagida, Wataru Nakayama, Hitoshi Matsushima
Rok vydání: 2023
Předmět:
Zdroj: Proceeding of Transport Phenomena in Thermal Engineering. Volume 2.
DOI: 10.1615/istp-vi.680
Popis: Experimental investigation was performed to study the pressure drop characteristics of parallel-plate channels where model packages of various sizes are mounted. The ratio of channel height to package height and placement pitch to package height are 1.3∼2.7 and 1.8∼5.6 for packages without fins, and 1.2∼2.0 and 2.1∼3.4 for finned packages, respectively. A new flow model is proposed which incorporates the three-dimensional nature of wakes behind the packages. The predicted values of pressure drop based on this model correlate with the experimental results within ±20∼30%.
Databáze: OpenAIRE