Identification of damage and fracture modes in power electronic packaging from experimental micro-shear tests and finite element modeling
| Autor: | Heung Soo Kim, Ahlem Baazaoui, Joël Alexis, Sabeur Msolli |
|---|---|
| Přispěvatelé: | Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE), Dongguk University (REPUBLIC OF KOREA), Laboratoire Génie de Production - LGP (Tarbes, France), Institut National Polytechnique de Toulouse - INPT (FRANCE), Department of Mechanical, Robotics and Energy Engineering, Dongguk University (DU), Laboratoire Génie de Production (LGP), Ecole Nationale d'Ingénieurs de Tarbes |
| Jazyk: | angličtina |
| Rok vydání: | 2018 |
| Předmět: |
Materials science
CZM model Electronic packaging 02 engineering and technology 01 natural sciences 0103 physical sciences [SPI.MECA.MEMA]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Mechanics of materials [physics.class-ph] Bifurcation theory General Materials Science Composite material Joint (geology) 010302 applied physics Finite element method (FEM) business.industry Mechanical Engineering GTN model Structural engineering 021001 nanoscience & nanotechnology Modélisation et simulation [INFO.INFO-MO]Computer Science [cs]/Modeling and Simulation Finite element method Shear (sheet metal) Micro-shear Cohesive zone model Mechanics of Materials Soldering Fracture (geology) Transient (oscillation) Mécanique des matériaux 0210 nano-technology business |
| Zdroj: | Engineering Fracture Mechanics Engineering Fracture Mechanics, Elsevier, In press, ⟨10.1016/j.engfracmech.2017.09.014⟩ |
| ISSN: | 0013-7944 |
| Popis: | International audience; Micro-shear tests are performed in order to characterize the mechanical behavior and the fracture of the chip/metallized ceramic substrate assemblies of power electronic devices. These assemblies are elaborated using three types of junctions: AuGe solder/Au or Ag finish, transient liquid phase bonding (TLPB) AgIn/Ag finish and Ag nanoparticles/Au or Ag finish. The experiments are associated to finite element simulations of both nano-indentation and micro-shear tests. The mechanical behavior of the different assembly interfaces is represented using an in-built cohesive zone model (CZM) available in the user friendly finite element code Abaqus. It is worth noting that the fracture mechanisms observed during the test and service periods of the power electronic packaging are not only due to the debonding at the interfaces but also to the initiation and growth of voids in the joint. Therefore, in addition to the CZM model, Gurson-Tvergaard-Needlmann (GTN) damage model is used in combination with the Rice bifurcation theory to correctly describe the fracture in the joint and, therefore the overall fracture mechanism of the entire junction. The simulation results are compared with the experimental force displacement curves and the SEM observations in order to assess the implemented model. |
| Databáze: | OpenAIRE |
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