Effect of Thermal Stresses Formed during Air Annealing of Amorphous Lanthanum Cuprate Thin Films Deposited on Silicon Substrate
| Autor: | Jean-Philippe Bauer, Pascal Boulet, Jean-François Pierson, Philippe Steyer, Fabien Capon, Annie Malchere, Nolwenn Tranvouez |
|---|---|
| Přispěvatelé: | Institut Jean Lamour (IJL), Université de Lorraine (UL)-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS), Matériaux, ingénierie et science [Villeurbanne] (MATEIS), Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS) |
| Jazyk: | angličtina |
| Rok vydání: | 2020 |
| Předmět: |
Materials science
Silicon genetic structures crystallization Annealing (metallurgy) chemistry.chemical_element 02 engineering and technology 01 natural sciences Thermal expansion law.invention [SPI.MAT]Engineering Sciences [physics]/Materials law 0103 physical sciences Materials Chemistry Thin film Composite material Crystallization Environmental scanning electron microscope 010302 applied physics Surfaces and Interfaces [CHIM.MATE]Chemical Sciences/Material chemistry Sputter deposition 021001 nanoscience & nanotechnology eye diseases Surfaces Coatings and Films Amorphous solid thermo-mechanical properties chemistry thin films lcsh:TA1-2040 La2CuO4 sense organs lcsh:Engineering (General). Civil engineering (General) 0210 nano-technology |
| Zdroj: | Coatings Volume 10 Issue 7 Coatings, MDPI, 2020, 10 (7), pp.613. ⟨10.3390/coatings10070613⟩ Coatings, Vol 10, Iss 613, p 613 (2020) |
| ISSN: | 2079-6412 |
| DOI: | 10.3390/coatings10070613 |
| Popis: | Amorphous thin films of La&ndash Cu&ndash O deposited by magnetron sputtering have been annealed at different temperatures and in situ analyzed by X-ray diffraction. These experiments were useful to determine the crystallization temperature and to follow the crystallization process of the film. The in situ annealing X-ray diffraction analyses have been also used to determine the thermal expansion coefficient of La2CuO4 thin film. The estimated value is close to that obtained for a commercial powder. The thermal expansion coefficient value with additional environmental scanning electron microscopy observations explains the delamination origin that occurs during the annealing before the crystallization step. The buckling and delamination of the film observed is caused by the thermal expansion coefficient mismatch of the film and the substrate. During the heating step, the mismatch generates compressive stress at the film/substrate interface, causing the film to lift off and crack in the typical way. |
| Databáze: | OpenAIRE |
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