Surface modification of a photo-definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper
| Autor: | David Schaubroeck, Johan De Baets, Emilie Van den Eeckhout, André Van Calster, Luc Van Vaeck, Peter Dubruel |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2012 |
| Předmět: |
Materials science
Physics chemistry.chemical_element Surfaces and Interfaces General Chemistry Epoxy Surface finish Adhesion Copper Surfaces Coatings and Films Adhesion strength X-ray photoelectron spectroscopy Electroless plating chemistry Mechanics of Materials visual_art Materials Chemistry visual_art.visual_art_medium Surface modification Composite material |
| Zdroj: | Journal of adhesion science and technology |
| ISSN: | 0169-4243 |
| Popis: | This paper describes the influence of polydopamine surface modifications on the adhesion strength of electroless deposited copper on roughened epoxy resin substrates. The surfaces are characterized with XPS and ToF-S-SIMS. Next, a thorough investigation of the copper-epoxy interface is performed using SEM. Both the polydopamine modification and the variation of the electroless plating bath temperature lead to new insights into the different contributions of chemical and physical adhesion to the overall adhesion strength. (C) Koninklijke Brill NV, Leiden, 2012 |
| Databáze: | OpenAIRE |
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