Wafer-level capping and sealing of heat sensitive substances and liquids with gold gaskets
| Autor: | Frank Niklaus, Mikael Antelius, Alessandro Tocchio, Göran Stemme, Martin Lapisa, Hans Sohlström |
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| Rok vydání: | 2013 |
| Předmět: |
010302 applied physics
Materials science Atmospheric pressure Gasket Metals and Alloys 02 engineering and technology Epoxy 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Surfaces Coatings and Films Electronic Optical and Magnetic Materials Heat sensitive visual_art 0103 physical sciences visual_art.visual_art_medium Forensic engineering Wafer Electrical and Electronic Engineering Composite material 0210 nano-technology Instrumentation Wafer-level packaging Flip chip |
| Zdroj: | Sensors and Actuators A: Physical |
| ISSN: | 0924-4247 |
| DOI: | 10.1016/j.sna.2013.07.007 |
| Popis: | This paper reports on a novel wafer-level packaging method employing gold gaskets and an epoxy underfill. The packaging is done at room-temperature and atmospheric pressure. The mild packaging cond ... |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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