Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending
| Autor: | Jeroen Schram, J. Van Den Brand, H J van de Wiel, Ashok Sridhar, Maarten Cauwe, Roel Kusters, D. A. van den Ende |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2014 |
| Předmět: |
Engineering
Bend radius ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION Ultra-thin chips Mechanical engineering HOL - Holst Bending Stress (mechanics) Flexural strength Hardware_INTEGRATEDCIRCUITS Mechanics Materials and Structures Electronics Electrical and Electronic Engineering Safety Risk Reliability and Quality ComputingMethodologies_COMPUTERGRAPHICS Bending strength Flexible electronics TS - Technical Sciences Industrial Innovation business.industry Condensed Matter Physics Chip Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Microcontroller Optoelectronics business Minimum bending radius |
| Zdroj: | Microelectronics Reliability, 12, 54, 2860-2870 |
| ISSN: | 2860-2870 |
| Popis: | Ultra-thin chips of less than 20 μm become flexible, allowing integration of silicon IC technology with highly flexible electronics such as food packaging sensor systems or healthcare and sport monitoring tags as wearable patches or even directly in clothing textile. The ultra-thin chips in these products will be bent to a very high curvature, which puts a large strain on the chips during use. In this paper a modified four-point bending method is presented, which is capable of measuring chip stress at high curvatures. The strength of several types of ultra-thin chips is evaluated, including standalone ultra-thin test chips and back-thinned 20 μm thick microcontrollers, as well as assemblies containing integrated ultra-thin microcontroller chips. The effect of chip thickness, bending direction and backside finish on strength and minimum bending radius is investigated using the modified four point bending method. The effect of bonding ultra-thin chips to flexible foils on the assembly strength and minimum bending radius is evaluated as well as the effect of bending on electrical properties of the bonded microcontroller dies. |
| Databáze: | OpenAIRE |
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