Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology
| Autor: | King Lien Tai, M. Wang, Yee L. Low, Kevin J. O'conner, Katsuharu Suzuki, Wayne W.-M. Dai |
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| Rok vydání: | 2002 |
| Předmět: |
Engineering
Hardware_MEMORYSTRUCTURES Scale (ratio) Computer science business.industry Integrated circuit design ChIP-on-chip Embedded system Datapath Hardware_INTEGRATEDCIRCUITS Integrated circuit packaging Physical design Synthesis system Field-programmable gate array business Computer hardware Dram |
| Zdroj: | ASP-DAC |
| Popis: | A field-programmable multi-chip module containing one ORCA 3T/125 FPGA and 4 MByte DRAM was built using chip-on-chip technology. Module architecture and physical design issues are presented. A PCI board consisting of four chip-on-chip modules is also built as the test vehicle. The design environment for this multi-chip module, including visual or C++ design entry and bit-serial datapath synthesis system, is also discussed. Some ongoing approaches, like double-flip technology and area I/O are also addressed. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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