Telephone cord buckles—A relation between wavelength and adhesion
| Autor: | Jean-Yvon Faou, Sergey Grachev, Etienne Barthel, Guillaume Parry |
|---|---|
| Přispěvatelé: | Surface du Verre et Interfaces (SVI), Centre National de la Recherche Scientifique (CNRS), Science et Ingénierie des Matériaux et Procédés (SIMaP), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut National Polytechnique de Grenoble (INPG)-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS), Sciences et Ingénierie de la Matière Molle (SIMM), Université Pierre et Marie Curie - Paris 6 (UPMC)-Ecole Superieure de Physique et de Chimie Industrielles de la Ville de Paris (ESPCI Paris), Université Paris sciences et lettres (PSL)-Université Paris sciences et lettres (PSL)-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS) |
| Jazyk: | angličtina |
| Rok vydání: | 2015 |
| Předmět: |
010302 applied physics
Materials science Mechanical Engineering Delamination 02 engineering and technology Adhesion 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Paint adhesion testing Wavelength Cohesive zone model Mechanics of Materials Residual stress 0103 physical sciences [PHYS.COND.CM-MS]Physics [physics]/Condensed Matter [cond-mat]/Materials Science [cond-mat.mtrl-sci] Thin film Composite material 0210 nano-technology Buckle |
| Zdroj: | Journal of the Mechanics and Physics of Solids Journal of the Mechanics and Physics of Solids, 2015, 75, pp.93-103. ⟨10.1016/j.jmps.2014.11.008⟩ Journal of the Mechanics and Physics of Solids, Elsevier, 2015, 75, pp.93-103. ⟨10.1016/j.jmps.2014.11.008⟩ |
| ISSN: | 0022-5096 |
| Popis: | International audience; Thin films with low adhesion and large residual stresses may buckle. The resulting morphologies are varied, but one of the most commonly observed is an intriguing oscillating pattern – the so-called "telephone cord" – which has been extensively investigated in the recent years. We have studied the kinematics of formation of telephone cords using a geometrically non-linear plate model and mode dependent interfacial toughness, captured via a cohe-sive zone. Through extensive Finite Element Simulations, we have demon-strated a simple, non trivial relation between telephone cord wavelength and interfacial toughness. To validate this prediction, highly stressed Mo thin films where deposited on Si wafers, with a well defined interface and very reproducible adhesion. Studying the morphology of the resulting buckles for different film thicknesses and stresses, we observed a trend which was fully consistent with our simulation results. From the data fit, an adhesion energy of 0.58 ± 0.04 Jm −2 for the SiO 2 /Ag interface was inferred, which compares well with literature estimates. |
| Databáze: | OpenAIRE |
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