Process development for dry etching polydimethylsiloxane for neural electrodes
| Autor: | Melissa P. Anenden, Martin Svehla, Gregg J. Suaning, Nigel H. Lovell |
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| Rok vydání: | 2011 |
| Předmět: |
Materials science
Polydimethylsiloxane Scanning electron microscope Photoelectron Spectroscopy technology industry and agriculture Nanotechnology macromolecular substances Microscopy Atomic Force chemistry.chemical_compound chemistry Chemical engineering X-ray photoelectron spectroscopy Etching (microfabrication) Electrode Microscopy Electron Scanning Surface roughness Dimethylpolysiloxanes Dry etching Reactive-ion etching Electrodes |
| Zdroj: | EMBC |
| DOI: | 10.1109/iembs.2011.6090817 |
| Popis: | In order to create high density electrode arrays, a reactive ion (dry) etching process was developed using sulphur hexafluoride (SF(6)) and oxygen (O(2)) plasma to pattern micro-structures in medical grade polydimethylsiloxane (PDMS). The surface topography and etch performance were analyzed by employing surface profilometry, scanning electron micrographs (SEM) and atomic force miscroscopy (AFM). The maximum etch rate was approximately 0.22 μm/min. The chemical modification of the PDMS structure in SF(6) and O(2) plasma was investigated through x-ray photoelectron spectroscopy (XPS). Micro-scale openings in PDMS were achieved using a dry etching method to allow charge injection at the electrode-tissue interface. |
| Databáze: | OpenAIRE |
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