High performance metallic joints from screen-printed Cu@Ag nanopastes

Autor: Thierry Baffie, Thomas Michaud, Sonia De Sousa Nobre, Jean-Michel Missiaen, Jean-Pierre Simonato, Didier Bouvard
Přispěvatelé: CEA/DRT/LITEN, Laboratoire d'Innovation pour les Technologies des Energies Nouvelles et les nanomatériaux (LITEN), Institut National de L'Energie Solaire (INES), Centre National de la Recherche Scientifique (CNRS)-Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Centre National de la Recherche Scientifique (CNRS)-Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Science et Ingénierie des Matériaux et Procédés (SIMaP), Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP ), Université Grenoble Alpes (UGA), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Centre National de la Recherche Scientifique (CNRS)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Centre National de la Recherche Scientifique (CNRS)
Jazyk: angličtina
Rok vydání: 2020
Předmět:
Zdroj: Materialia
Materialia, Elsevier, 2020, 14, pp.100871. ⟨10.1016/j.mtla.2020.100871⟩
Materialia, 2020, 14, pp.100871. ⟨10.1016/j.mtla.2020.100871⟩
ISSN: 2589-1529
DOI: 10.1016/j.mtla.2020.100871⟩
Popis: Recently developed Cu@Ag nanoparticles render sintering process under air possible at low temperature for die attach application in power electronics devices. The development of Cu@Ag nanoparticles aims to decrease the cost of sintering nanopastes usually composed of pure silver nanoparticles. In this study, specific formulations of highly concentrated Cu@Ag nanoparticles based pastes were developed and their densification behavior was studied through dilatometry. The addition of a 6 nm silver shell around copper nanoparticles leads to a decrease of the densification temperature by almost 80 °C. The achievement of highly densified metallic joints by hot pressing was fully characterized and demonstrated. Shear strengths above 20 MPa were measured after sintering under air at 200 °C. Under inert atmosphere at 285 °C, values up to 58 MPa were reached. These results demonstrate that Cu@Ag based nanopastes appear as a promising alternative to the common nano-silver based products for the production of high performance metallic joints.
Databáze: OpenAIRE