Polyaramid-Based Flexible Antibacterial Coatings Fabricated Using Laser-Induced Carbonization and Copper Electroplating
Autor: | Jan G. Korvink, Fabian Falk, Emil R. Mamleyev, Christof Wöll, C.N. Shyam Kumar, Christian Kübel, Sagar Wadhwa, Monsur Islam, Omar Nassar, Stefan Heissler, Peter G. Weidler, Dario Mager |
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Jazyk: | angličtina |
Rok vydání: | 2020 |
Předmět: |
Technology
Fabrication Materials science 020209 energy chemistry.chemical_element 02 engineering and technology 2019-023-027429 Escherichia coli 0202 electrical engineering electronic engineering information engineering Copper plating General Materials Science Nomex Composite material Electroplating Sheet resistance Carbonization Lasers Copper Carbon Anti-Bacterial Agents Kapton Nylons chemistry TEM ddc:600 Bacillus subtilis |
Zdroj: | ACS applied materials & interfaces, 12 (47), 53193–53205 ACS Applied Materials & Interfaces |
ISSN: | 1944-8244 1944-8252 |
DOI: | 10.5445/ir/1000126278 |
Popis: | A method for the fabrication of flexible electrical circuits on polyaramid substrates is presented based on laser-induced carbonization followed by copper electroplating. Locally carbonized flexible sheets of polyaramid (Nomex), by laser radiation, create rough and highly porous microstructures that show a higher degree of graphitization than thermally carbonized Nomex sheets. The found recipe for laser-induced carbonization creates conductivities of up to ∼45 S cm-1, thereby exceeding that observed for thermally pyrolyzed materials (∼38 S cm-1) and laser carbon derived from Kapton using the same laser wavelength (∼35 S cm-1). The electrical conductivity of the carbonized tracks was further improved by electroplating with copper. To demonstrate the electrical performance, fabricated circuits were tested and improvement of the sheet resistance was determined. Copper films exhibit antimicrobial activity and were used to fabricate customized flexible antibacterial coatings. The integration of laser carbonization and electroplating technologies in a polyaramid substrate points to the development of customized circuit designs for smart textiles operating in high-temperature environments. |
Databáze: | OpenAIRE |
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