Power inside — Applications and technologies for integrated power in microelectronics

Autor:	Paul McCloskey, Joseph O'brien, G. Maxwell, Santosh Kulkarni, Declan P. Casey, A.-M. Kelleher, James F. Rohan, Zoran Pavlovic, Cian O Mathuna
Rok vydání:	2017
Předmět:	Silicon PwrSiP platforms Thin-film coupled-inductor Computer science 02 engineering and technology Inductor Signal Magnetic cores Windings Microelectronics Power system management Frequency 100.0 MHz 0202 electrical engineering electronic engineering information engineering Inductors PwrSoC System on a chip Integrated magnetics Inductance business.industry 020208 electrical & electronic engineering Electrical engineering Process (computing) Frequency 60.0 MHz 020206 networking & telecommunications Power (physics) Power supply in package platforms Electromagnetic coil Power supply circuits business Integrated power supply on chip System-on-chip
Zdroj:	2017 IEEE International Electron Devices Meeting (IEDM).
DOI:	10.1109/iedm.2017.8268318
Popis:	The emergence of miniaturized and integrated Power Supply on Chip (PwrSoC) and Power Supply in Package (PwrSiP) platforms will be enabled by the application of thin-film, integrated magnetics on silicon. A process flow for, and the design of, a thin-film coupled-inductor, switching at 60MHz, is described. Based on the large signal characterization data, measured up to 100MHz, the efficiency of the inductor is calculated to be 91.7% for a power of 0.5W.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::94b4ba3df9104743e89b05d8b2c5f522 https://doi.org/10.1109/iedm.2017.8268318 Zobrazit plný text záznamu