Microshear Bond Strength of Resin Cements to Commercially Pure Titanium Using Universal Adhesives and Alloy Primer
| Autor: | Hamideh Sadat Mohammadipour, Fatemeh Taghvaei, Mohammadreza Nakhaei |
|---|---|
| Rok vydání: | 2022 |
| Předmět: |
Dental Stress Analysis
Titanium Commercially pure titanium Materials science RelyX Unicem Surface Properties Bond strength Dental Bonding Dental Cements Thiones Thermal aging General Medicine Adhesion Alloy Primer Shear bond Resin Cements Materials Testing Methacrylates Adhesive Oral Surgery Shear Strength Nuclear chemistry |
| Zdroj: | The International Journal of Prosthodontics. 35:186-193 |
| ISSN: | 0893-2174 |
| DOI: | 10.11607/ijp.6949 |
| Popis: | PURPOSE To evaluate the micro-shear bond strength (μSBS) of different bonding protocols to commercially pure titanium (CP Ti) using two universal adhesives and Alloy Primer. MATERIALS AND METHODS A total of 120 cubes of CP Ti were airborne-particle abraded and then divided into 6 groups (n = 20 each) according to bonding protocol: (1) Scotchbond Universal (SU; 3M ESPE), (2) Alloy Primer (AP; Kuraray) + SU; (3) G-Premio Bond (GP; GC); or (4) AP + GP. The specimens from groups 1 to 4 were cemented with RelyX Unicem (3M ESPE), while those from groups 5 and 6 were cemented using Panavia F2.0 cement (PAN; Kuraray) without and with prior AP application, respectively. After 24 hours, half the specimens were subjected to μSBS measurement and the other half to thermocycling (5,000 cycles) before testing. Data were analyzed using Shapiro-Wilk, two-way analysis of variance, Games-Howell, and independent sample t test (α = .05). RESULTS The μSBS values obtained from the AP + SU group were significantly higher than from the GP (P = .003) and the AP + GP (P = .022) groups. After thermocycling, the μSBS of both groups treated with SU were significantly higher than those other groups (P < .001). The application of AP could not improve adhesion of resin cements to CP Ti. Thermocycling significantly reduced the μSBS values of the PAN group, whereas it noticeably enhanced the adhesion of SU and AP + SU. The predominant failure mode in all groups was adhesive. CONCLUSION The application of AP, followed by SU, produced the most effective bonding to CP Ti, which was able to endure limited thermal aging. |
| Databáze: | OpenAIRE |
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