Design and Optimization Techniques of Over-Chip Bondwire MicroTransformers with LTCC core

Autor: Antonio Camarda, Marco Tartagni, Saibal Roy, Rudi Paolo Paganelli, Enrico Macrelli, Aldo Romani
Přispěvatelé: Antonio, Camarda, Enrico, Macrelli, Rudi, Paolo Paganelli, Marco, Tartagni, Saibal, Roy, Aldo, Romani
Jazyk: angličtina
Rok vydání: 2018
Předmět:
Wire bonding
Silicon
Power supply on chip (PwrSoC)
Energy Engineering and Power Technology
Toroidal magnetic field
02 engineering and technology
Integrated circuit
Inductor
over-chip
01 natural sciences
On-chip
law.invention
Magnetic transformer
power supply in package
Fabrication
Magnetic core
law
Soft magnetic material
Wire
0103 physical sciences
0202 electrical engineering
electronic engineering
information engineering

Inductors
Harvesting
Electrical and Electronic Engineering
Inductance
Micromagnetics
Electronic circuit
010302 applied physics
Physics
Transformer
Boost converter
020208 electrical & electronic engineering
Magnetic-core
Ferrite
Low-temperature co-fired ceramic
low-temperature co-fired ceramics
Computational physics
Power supply in package (PwrSiP)
Power
Magnetic cores
Soft magnetic materials
System-on-chip
Toroidal magnetic fields
Wires
Bonding wire
Energy harvesting applications
Coupling coefficient of resonators
power supply on chip
Zdroj: IEEE Journal of Emerging and Selected Topics in Power Electronics Volume: 6, Issue 2 (2018): 592–603. doi:10.1109/JESTPE.2017.2751745
info:cnr-pdr/source/autori:Camarda A.; Macrelli E.; Paganelli R.P.; Tartagni M.; Roy S.; Romani A./titolo:Design and Optimization Techniques of Over-Chip Bondwire MicroTransformers with LTCC core/doi:10.1109%2FJESTPE.2017.2751745/rivista:IEEE Journal of Emerging and Selected Topics in Power Electronics/anno:2018/pagina_da:592/pagina_a:603/intervallo_pagine:592–603/volume:Volume: 6, Issue 2
DOI: 10.1109/JESTPE.2017.2751745
Popis: none 6 si This paper describes the realization of bond-wire micro-magnetics by using standard bonding-wires and a toroidal ferromagnetic LTCC core with high resistivity. The proposed fabrication procedure is suitable for the development of magnetic components on top of an IC with small profile and small size (< 15 mm2). A transformer is designed and applied over-chip, working in the MHz range with high inductance (~33 μ H) and high effective turns-ratio (~20). Applications include bootstrap circuits and micro-power conversion for energy harvesting. Measurements demonstrate a maximum secondary Q-factor of 11.6 at 1.3 MHz, and a coupling coefficient of 0.65 with an effective turns ratio of 19, which are among the highest values reported for toroidal miniaturized magnetics. The achieved inductance density is 2 μH/mm2, along with an inductance per unit core volume of 15.6 μH/mm3, and a DC inductance-to-resistance ratio of 2.23 μH/Ω. The presented technique allows to obtain over-chip magnetics trough a post-processing of the core, and it is also suitable for highdensity power supply in package (PwrSiP) and power supply on chip (PwrSoC). Finally, a series of optimization techniques for planar core magnetic devices in order to maximize the inductance per unit area are discussed and applied to the considered case. mixed Antonio, Camarda; Enrico, Macrelli; Rudi, Paolo Paganelli; Marco, Tartagni; Saibal, Roy; Aldo, Romani Camarda, Antonio; Enrico, Macrelli; Rudi, Paolo Paganelli; Tartagni, Marco; Saibal, Roy; Romani, Aldo
Databáze: OpenAIRE