Thermo-mechanical assessment of silver sintering for attaching power components in embedded PCB
| Autor: | Toni Youssef, O. Belnoue, G. Coquery, M. Coudert, N. Alayli, F. Arabi, Donatien Martineau |
|---|---|
| Přispěvatelé: | VEhicule DEcarboné et COmmuniquant et sa Mobilité (VeDeCom), Safran Tech |
| Jazyk: | angličtina |
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Materials science 020208 electrical & electronic engineering Sintering 02 engineering and technology Temperature cycling Condensed Matter Physics 01 natural sciences Atomic and Molecular Physics and Optics Die (integrated circuit) Surfaces Coatings and Films Electronic Optical and Magnetic Materials Power (physics) [SPI]Engineering Sciences [physics] 0103 physical sciences Thermal 0202 electrical engineering electronic engineering information engineering Shear strength Miniaturization Junction temperature Electrical and Electronic Engineering Composite material Safety Risk Reliability and Quality |
| Zdroj: | Microelectronics Reliability Microelectronics Reliability, Elsevier, 2020, 114, pp.113900-. ⟨10.1016/j.microrel.2020.113900⟩ |
| ISSN: | 0026-2714 |
| Popis: | PCB-Embedding technology is an established approach for the miniaturization of electronic systems and modules. Silver sintering, which is a reliable alternative to Lead-Free Bonding, is used to assemble the embedded power components in the PCB. Thermal cycles [−25 °C/+125 °C] have highlighted degradations in the die attach. The shear strength of dice decreases from 4 MPa before cycling to 2 MPa at 1040 cycles. The junction temperature has drifted during cycling especially at high temperatures. Simulations have shown that the maximal stresses are in the preg materials. This suggests cracks of the preg during the experiments. Simulations showed also a concentration of plastic stresses on the die attaches. The accumulation of stresses increases during aging. The presented methodology of thermal cycling simulation represents a good way to estimate the lifetime of embedded PCB. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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