Electrical Signatures of Corrosion and Solder Bond Failure in c-Si Solar Cells and Modules
| Autor: | Muhammad A. Alam, Xingshu Sun, Reza Asadpour |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Photocurrent
Materials science Moisture 020209 energy Bond failure FOS: Physical sciences Applied Physics (physics.app-ph) Physics - Applied Physics 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics Electronic Optical and Magnetic Materials Corrosion Soldering 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering Composite material 0210 nano-technology Grid design Voltage |
| Zdroj: | IEEE Journal of Photovoltaics. 9:759-767 |
| ISSN: | 2156-3403 2156-3381 |
| Popis: | Moisture- and temperature-activated corrosion of metal fingers, mechanical stress induced delamination, and failure of solder bonds rank among the leading failure mechanisms of solar modules. The physics of moisture ingress, diffusion and reaction have been explored in detail, but the electrical implications of corrosion and delamination on specific front-surface grid geometry is not fully understood. In this paper, we show that the module efficiency loss due to corrosion, delamination, and solder bond failure (CDS) involves a complex interplay of voltage/current redistribution, reflected as a loss in photocurrent as well as decrease/increase in shunt/series resistances. Our work will redefine the interpretation of experimental J-V characteristics features due to degradation mechanisms, integrate a variety of scattered and counter-intuitive experimental results within a common theoretical framework, and inform CDS-resistant grid design for solar modules. 8 pages, 11 figures |
| Databáze: | OpenAIRE |
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