Benzocyclobutene wafer bonding for III-V nanophotonic guiding structures
| Autor: | S. Garidel, Jean-Pierre Vilcot, S. McMurtry, D. Lauvernier, Didier Decoster |
|---|---|
| Přispěvatelé: | Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 (IEMN), Centrale Lille-Institut supérieur de l'électronique et du numérique (ISEN)-Université de Valenciennes et du Hainaut-Cambrésis (UVHC)-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF) |
| Jazyk: | angličtina |
| Rok vydání: | 2005 |
| Předmět: |
chemistry.chemical_classification
Nanostructure Fabrication Materials science business.industry Wafer bonding 020208 electrical & electronic engineering Nanophotonics Nanotechnology 02 engineering and technology Polymer chemistry.chemical_compound 020210 optoelectronics & photonics Semiconductor chemistry Benzocyclobutene 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering Photonics business |
| Zdroj: | Electronics Letters Electronics Letters, 2005, 41, pp.1170-1172 Electronics Letters, IET, 2005, 41, pp.1170-1172 |
| ISSN: | 0013-5194 1350-911X |
| Popis: | An adhesive wafer bonding technique for the fabrication of nanophotonic guiding structures, the design of which consists of a III-V semiconductor core buried in a polymer matrix, is reported. The bonding was realised owing to benzocyclobutene. Nanostructures are perfectly embedded in the void-free matrix to form high density photonic circuits. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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