Copper–rubber interface delamination in stretchable electronics

Autor: Jan Neggers, van der O Olaf Sluis, Jpm Johan Hoefnagels, Mgd Marc Geers, Phm Peter Timmermans
Přispěvatelé: Department of Mechanical Engineering [Eindhoven], Eindhoven University of Technology [Eindhoven] (TU/e)-Technische Universiteit Eindhoven (TU/e), Laboratoire de Mécanique et Technologie (LMT), École normale supérieure - Cachan (ENS Cachan)-Centre National de la Recherche Scientifique (CNRS), Philips Research Laboratories [Eindhoven], Mechanics of Materials, Mechanical Engineering, Group Geers, Group Hoefnagels
Rok vydání: 2010
Předmět:
Zdroj: Scripta Materialia
Scripta Materialia, Elsevier, 2010, 63 (8), pp.875--878. ⟨10.1016/j.scriptamat.2010.06.041⟩
Scripta Materialia, 63(8), 875-878. Elsevier
ISSN: 1359-6462
DOI: 10.1016/j.scriptamat.2010.06.041
Popis: International audience; Interface delamination in metal–rubber-type stretchable electronic systems leads to early failure. This paper reports an investigation of metal–rubber interfaces through in situ scanning electron microscopy imaging of the progressing delamination front of 90° peel tests of rubber on copper samples. The results show that the energy dissipated in the forming, elongation and rupture of ∼50 μm long fibrils constitutes the major part of the work of separation. The experiments are characterized and modeled using a cohesive zone-enriched finite-element model.
Databáze: OpenAIRE