Novel thermoplastic bonding using a bulk metallic glass solder
| Autor: | Jin-Yoo Suh, Carol M. Garland, R. Dale Conner, William L. Johnson, Boonrat Lohwongwatana, Daewoong Suh |
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| Rok vydání: | 2008 |
| Předmět: |
chemistry.chemical_classification
Materials science Thermoplastic Amorphous metal Mechanical Engineering Metals and Alloys chemistry.chemical_element Condensed Matter Physics Copper chemistry Rheology Mechanics of Materials Soldering General Materials Science Wetting Composite material Supercooling Layer (electronics) Caltech Library Services |
| Zdroj: | Scripta Materialia. 59:905-908 |
| ISSN: | 1359-6462 |
| Popis: | A novel thermoplastic bonding concept is demonstrated based on the unique rheological behavior and pattern-replicating ability of bulk metallic glass (BMG)-forming liquids. In this approach, the BMG is heated above Tg to the “supercooled liquid” region while a small normal force is applied to the joint. This results in liquid reflow, wetting and a strong bond. Complete wetting between copper substrates and a layer of platinum-based BMG leads to an atomistically intimate void-free interface. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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