IMPACT OF THERMAL FATIGUE ON YOUNG’S MODULUS OF EPOXY ADHESIVES
| Autor: | Mariusz Kłonica |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2015 |
| Předmět: |
Thermal shock
Technology Materials science Manufactures Modulus Young's modulus Environmental technology. Sanitary engineering TS1-2301 symbols.namesake Adhesive materials TJ1-1570 Young’s modulus Mechanical engineering and machinery Composite material thermal shock TD1-1066 Thermal fatigue General Medicine Epoxy Atmospheric temperature range epoxy adhesive Engineering (General). Civil engineering (General) visual_art Hysol 3421 symbols visual_art.visual_art_medium Adhesive Hysol 9466 TA1-2040 |
| Zdroj: | Advances in Science and Technology Research Journal, Vol 9, Iss 28, Pp 103-106 (2015) |
| ISSN: | 2299-8624 2080-4075 |
| Popis: | The following paper presents a comparative analysis of two epoxy-based adhesives: Hysol 9466 and Hysol 3421, prior to and after thermal shock testing. The tests focused on determining Young’s modulus. Epoxy-based materials are among the most widespread adhesive materials used as universal structural adhesives. The prepared epoxy samples (Hysol 9466 and Hysol 3421) were subjected to thermal shock cycling tests, according to a specified programme, in a thermal shock testing chamber, at a temperature range –40 °C to +60 °C and in the number of 200 cycles. Conclusions from the tests are presented at the final stage of the paper. |
| Databáze: | OpenAIRE |
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