Radiation effects in nitride read-only memories

Autor: G. Cannella, T. Schillaci, Fabio Principato, Felix Palumbo, F. Celi, Sebania Libertino, D. Corso, G. Muré, M. Lisiansky, Antonio Marino, Yakov Roizin, S. Lombardo, S. Giarusso
Přispěvatelé: Libertino,S, Corso,D, Murè,G, Marino,A, Palumbo,F, Principato,F, Cannella,G, Schillaci,T, Giarusso,S, Celi,F, Lisiansky,M, Roizin,Y, Lombardo,S
Rok vydání: 2010
Předmět:
Zdroj: Microelectronics and reliability 50 (2010): 1857–1860. doi:10.1016/j.microrel.2010.07.06
info:cnr-pdr/source/autori:Libertino S; Corso D; Mure G; Marino A; Palumbo F; Principato F; Cannella G; Schillaci T; Giarusso S; Celi F; Lisiansky M; Roizin Y; Lombardo S/titolo:Radiation effects in nitride read-only memories/doi:10.1016%2Fj.microrel.2010.07.06/rivista:Microelectronics and reliability/anno:2010/pagina_da:1857/pagina_a:1860/intervallo_pagine:1857–1860/volume:50
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2010.07.068
Popis: We report on the influence of different types of radiation on the nitride read-only memories (NROM®). The memory cells were irradiated by light ions (Boron), X-rays and γ-rays. Memory transistor parameters, such as threshold voltage and subthreshold drain leakage were studied as a function of the accumulated radiation dose and compared to the as-programmed (-erased) devices parameters. Their time evolution was registered in the range from few hours up to 5 months after the irradiation. The NROM® cells showed good radiation robustness up to high accumulated doses. Sufficient program margin (difference of threshold voltage in the programmed state and the read-out voltage level) remained after γ or X irradiation for absorbed doses exceeding 50 krad(Si) and 100 krad(Si), respectively. For Boron irradiation, the programmed devices remained stable up to the fluence of 10 11 ions/cm 2 (equivalent to 1 Mrad(Si) of TID tolerance).
Databáze: OpenAIRE