Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications
| Autor: | V. Mandrillon, H. Boutry, K. Inal, Roland Fortunier, M. D. Diop |
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| Přispěvatelé: | Département Packaging et Supports Souples (PS2-ENSMSE), École des Mines de Saint-Étienne (Mines Saint-Étienne MSE), Institut Mines-Télécom [Paris] (IMT)-Institut Mines-Télécom [Paris] (IMT)-CMP-GC, Équipe de Recherche Commune CEA - EMSE (SESAM : Secured Embedded Systems And Microelectronics) (ERC CEA / EMSE), Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Département Microstructures et Propriétés Mécaniques (MPM-ENSMSE), Institut Mines-Télécom [Paris] (IMT)-Institut Mines-Télécom [Paris] (IMT)-SMS, Plasticité, Endommagement et Corrosion des Matériaux (PECM-ENSMSE), Institut Mines-Télécom [Paris] (IMT)-Institut Mines-Télécom [Paris] (IMT)-SMS-Centre National de la Recherche Scientifique (CNRS) |
| Rok vydání: | 2010 |
| Předmět: |
Materials science
Contact resistance Micro-insertion Creep Nanoindentation Condensed Matter Physics Atomic and Molecular Physics and Optics Electrical contacts [SPI.MAT]Engineering Sciences [physics]/Materials Surfaces Coatings and Films Electronic Optical and Magnetic Materials [PHYS.MECA.MEMA]Physics [physics]/Mechanics [physics]/Mechanics of materials [physics.class-ph] Electrical contact resistance Nanoindenter Elastic–plastic deformation Nickel [SPI.MECA.MEMA]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Mechanics of materials [physics.class-ph] Phenomenological model Aluminium Electrical and Electronic Engineering Thin film Deformation (engineering) Composite material |
| Zdroj: | Microelectronic Engineering Microelectronic Engineering, 2009, 87 (3), pp.522-526. ⟨10.1016/j.mee.2009.07.020⟩ Microelectronic Engineering, Elsevier, 2009, 87 (3), pp.522-526. ⟨10.1016/j.mee.2009.07.020⟩ |
| ISSN: | 0167-9317 1873-5568 |
| DOI: | 10.1016/j.mee.2009.07.020 |
| Popis: | This paper investigates the mechanical deformation and the electrical contact resistance of an electroplated Ni micro-cylinder called micro-insert inserted in an Al thin film. A modified nanoindentation apparatus is used to perform the experiments with [email protected], [email protected] and [email protected] diameters micro-inserts having the same [email protected] height. Mechanical deformation of Ni micro-insert and Al film is described at different maximum loads corresponding to an equivalent stress of 0.8GPa, 1.6GPa and 3.2GPa. At equivalent stress less than 1.6GPa, Ni micro-insert exhibits an elastic deformation while at 3.2GPa it presents an elastic-plastic deformation with a large amount of compression and penetration into micro-insert foundation. Visco-plastic deformation of Al film is noticed during hold at all maximum loads. Beside, Al creep parameters are extracted using a combined Maxwell/Kelvin-Voigt phenomenological model. Mechanical results are coupled to electrical contact resistance measurement. |
| Databáze: | OpenAIRE |
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