3D Sequential Integration: Application-driven technological achievements and guidelines

Autor:	C. Comboroure, M. Zussy, L. Pasini, N. Rambal, J.-B. Pin, François Martin, V. Balan, Perrine Batude, C. Vizioz, J.M. Hartmann, Virginie Loup, N. Allouti, Sébastien Barnola, A. Duboust, Frédéric Mazen, O. Faynot, Louis Hutin, Mazzocchi, R. Berthelon, A. Ayres, Gilles Sicard, F. Deprat, Sebastien Hentz, J.-P. Colinge, Francois Andrieu, B. Mathieu, S. Beaurepaire, J. Micout, F. Ponthenier, E. Vianello, F. Fournel, O. Rozeau, E. Avelar Mercado, V. Ripoche, V. Beugin, Cristiano Santos, M.-P. Samson, Pascal Vivet, D. Larmagnac, S. Barraud, C. Euvrard-Colnat, Sebastien Kerdiles, M. Vinet, Benoit Sklenard, P. Acosta Alba, Sebastien Thuries, C. Fenouillet-Beranger, Philippe Rodriguez, X. Garros, Fabrice Nemouchi, R. Gassilloud, O. Billoint, Julien Arcamone, Pascal Besson, Didier Lattard, M. Casse, Laurent Brunet, C.-M. V. Lu, Bernard Previtali
Jazyk:	angličtina
Předmět:	010302 applied physics Materials science Silicon Interface (computing) Stacking chemistry.chemical_element Ranging 02 engineering and technology 021001 nanoscience & nanotechnology 01 natural sciences 7. Clean energy Engineering physics Annealing (glass) chemistry 0103 physical sciences Thermal Hardware_INTEGRATEDCIRCUITS Field-effect transistor Thermal stability 0210 nano-technology
Zdroj:	2017 IEEE International Electron Devices Meeting (IEDM)
DOI:	10.1109/iedm.2017.8268316
Popis:	3D Sequential Integration (3DSI) with ultra-small 3D contact pitch (
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8916f9812bae1365018dd5e6a7aa88d0 Zobrazit plný text záznamu